Job Opportunities in Taiwan

Google welcomes people with disabilities.

Minimum qualifications:

• Bachelor's degree in a technical field, or equivalent practical experience.
  
• 5 years of experience in program management.
  
• 5 years of experience as a Semiconductor Packaging Engineer.
  
• Experience in packaging technologies, assembly processes, Integrated Circuit (IC) packaging materials, reliability standards, Failure Analysis (FA) techniques.
  
• Experience in leading cross-functional teams.
  
• Ability to travel as required.

Preferred qualifications:

• Master's degree or Ph D in Electrical Engineering, Computer Engineering or Material Engineering or a related field.
  
• Experience with So C and Power Management Integrated Circuit (PMIC) productization.
  
• Experience in data analysis using semiconductor production data.
  
• Understanding of Wafer Level Packaging, 2.5D packaging and 3D packaging technology.
  
• Ability to work in a fluid environment.
  
• Excellent written and verbal communication skills.
  

Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. See also Google's EEO Policy and EEO is the Law. If you have a disability or special need that requires accommodation, please let us know by completing our Accommodations for Applicants form.