February 29, 2024

Micron

ASIC/PMIC Packaging – Principal Technical Program Manager

Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR45164 ASIC/PMIC Packaging – Principal Technical Program Manager
The ASIC Package Design Principal Technical Program Manager (TPM) is responsible for package assembly execution and qualification, from ASIC co-design start to ASIC qualification and release into high-volume-manufacturing. The TPM has final approval of all risks associated with package design and assembly processing, and the TPM represents both package design and assembly process engineering in Product Development Team (PDT) meetings and Business Unit meetings.

Responsibilities

Maintain ASIC packaging roadmap
Accountable for package technical requirements specifications for internal/external designed and ensuring customer specific requirements are captured and addressed
Ownership of package technical requirements for design, assembly, and board level integration
Support ASIC Design & System Architecture pathfinding activities with package design solution proposals and coordinate budgetary costing for solutions
Collaborate with ASIC Package Design & ASIC assembly process engineering to maintain project schedules from feasibility through HVM release and reduce package risks
Attend package NPI phase gate reviews & sign-off, work with internal engineering drive resolution of package design & assembly issues
Drive business process improvements and work to close any systemic gaps with business partners
Provide engineering recommendations to ASIC Design, Package Design, SIPI engineering, ASIC Quality Engineering, Foundry Engineering, Supply Chain/Procurement, and Assembly Process Engineering to ensure there is an appropriate balance between quality, performance, and cost

Requirements

The applicant should have a BS degree or higher in EE, ME, Mat E, Chem E, etc. with 15+ years of relevant experience
Flip chip assembly experience with CPI knowledge
Assembly outsourcing management experience
Experience with wafer bumping, fan-in, fan-out wafer level or panel level packaging is desirable
Experience with 2.5D and 3D advanced packaging is a plus
Good communication and presentation skills
Able to work in a global environment across multiple time zones and countries
Outsourcing experience with foundries, wafer bumping, probe, and/or test is a plus

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.