Senior IC Packaging Engineer

August 6, 2024

NVIDIA

新竹市

OTHER

Package engineer will join NVIDIA Networking IC package team, leading advanced IC packaging projects at the cutting edge of technology.

In this position, Package Engineer will be representing the Networking Packaging team engineering activities and collaborating with suppliers, design and operations team. The candidate is expected to provide technical expertise and leadership throughout the product lifecycle, drive manufacturing feedback to improve packaging supply robustness and support new product introduction and process optimization. The position is located in Taiwan, reporting to NVIDIA Networking HQ in Israel (remote).

What you will be doing:

Leading development of cutting-edge microelectronics packaging of Nvidia Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.
Review manufacturability readiness at each milestone.
Work with world leading vendors to develop highly challenging packaging solutions.
Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.

What we need to see:

Mechanical/Material Engineering degree, or any related equivalent experience.
5+ years of relevant work experience in the semiconductor packaging industry, substrate manufacturing site or assembly site.
Basic design skills, such as using 2D Artios CAD, and 3D NX/Solid Works/Creo applications.
Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.
High awareness for quality, robustness, and manufacturability.
High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
Curious and creative problem solver, well organized and multi-tasker.
Good English, verbal and written communication skills.

Ways to stand out from the crowd:

Experience with mechanical CAD software (Solidworks, Spaceclaim).
Experience with development of mechanical FEA simulations using Ansys software.
Experience managing multiple packaging projects in cross-functional settings.
NPI processes leadership, including working with operations on manufacturing and quality.

With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the most desirable employers in the world. We have some of the most brilliant and talented people in the world working for us. If you are creative, autonomous and love a challenge, we want to hear from you. We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

We regret to inform you that this job opportunity is no longer available