Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
Qualcomm Overview:
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.
General Summary:
The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC designers to find ways to optimize the overall package design. The candidate’s responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as PCIe, UFS, USB, MIPI, LPDDR, etc, and also with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as PHY team, PCB team and PSIG and providing timely feedback and updating design guideline to the team is essential.
The responsibilities will include but not be limited to the following:
- Perform package extraction for the time domain and frequency domain analysis
- Perform system-level analysis for DDR, Ser Des & Mixed signal interfaces
- Provide design guidelines for the Package design
- Develop design & analysis flow and automate the process
- Create technical documentation and presentations
Minimum Qualifications:
- 3+ years of experience in DDR/Ser Des in Package/PCB/System Design related to mobile standards
- Experience in Electromagnetics and solid background on transmission line theory & Crosstalk
- Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity
- Experience in simulation tools such as ADS and Hspice
- Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition
Preferred Qualifications:
- Experience in programming language(c/c++) or scripting language(Perl/Python) is a plus
- Experience in Matlab to be able to automate existing simulation flow
- Experience in design specifications such as LPDDRx, MIPI(CSI, DSI), PCIe , UFS
- Master Degree with 3 ~ 4 years of experiences is preferred, Ph.D with minimal experience is considered as well
Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail myhr.support@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.
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If you would like more information about this role, please contact Qualcomm Careers.