August 23, 2024

Micron

台中市

PDE Package Materials Engineer

Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR59412 PDE Package Materials Engineer
As a PDE Package Characterization Engineer you will be primarily responsible for defining, planning, and characterize new packages to improve product quality and reliability, working on second source and cost reduction, productivity improvement and risk management. You will also be required to identify, diagnose, and resolve assembly process related problems by applying failure analysis, and some materials analysis methodology. Additional responsibilities include coordinating and carrying out lab sourcing and material evaluation/optimization to assess reliability risks especially in those changes at assembly process step, leading and participating in cost reduction activities, handling new process baseline characterization, and liaising with material suppliers to achieve quality, cost and risk management objectives.

Responsibilities

Collaborate with die attach material suppliers in meeting Micron materials specification and roadmaps.
Own overall material characterization planning and execution.
Collaborate with taskforce team on materials and package characterization.
Take the lead in driving resolution of issues encountered during package characterization.
Package characterization tracking and forecasting for new package NPIs, post reliability survivor analysis.
Be the Point-of Contact pertaining to all aspects of products/packages associated with die attach materials.
Develop strategies to drive materials improvement.

Requirements

MS above in Electronics/ Electrical/ Chemical/ Materials Engineering
Experience in packaging materials, die attach materials.
Experience in package failure analysis or materials characterization skills is an advantage.
Well-versed in semiconductor packaging process, materials, and reliability interaction
Possess initiative and ability to work independently.
Good English skill in both oral and written.
Knowledge in the PLM software (teamcenter) and production management is a plus

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_tw@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.