External Manufacturing Operation Engineering

August 5, 2024

onsemi

OTHER

Description
As a key member of onsemi's external manufacturing team, you will interact with strategic contracted semiconductor manufacturers in Asia daily.

You are ultimately expected to own the operational key performance indices of the assigned contracted manufacturers. Key Indices will involve continuous improvement plans or projects related to quality, yield, capacity expansion and operation excellence through Change Management process.

There will be collaboration work with Assembly and Test suppliers to drive Operation Excellence, quality execution (Maverick, MRB, and Customer Complaint), overcoming capacity and process constraints to support customers’ demand.

You will take leadership role in all operation matters related to assign suppliers while supporting internal customers in areas of quality complain response, yield improvements, secure line capacity, OTD, and drive OEE improvement etc.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

BS degree or above in Electrical Engineering, Chemistry Engineering, Material Science or related area.
Min. 7 years of experience working with Advanced packaging manufacturing or Assembly Process Engineering. Hands on experience with Die Attached, Wire Bonding, Molding or Encapsulation is highly preferred.
Basic understanding of Probe and Final Test hardware and testing requirement
Comprehension of HVM quality control and problem-solving methodologies. (e.g.: Is/ Is Not, 3-5 why, Fail Tree, 8D…etc.).
Comprehension of statistical means in HVM sustain and improvement.
Ability to work independently with good communication/interpersonal skills.
Excellent in reading and writing English. Ability to communicate fluency in oral English is a plus.
Other experiences that, if have, would be a plus: Quality management, Product Engineering, Supply Chain planning.
Flexible in local travel (sometimes around East Asia area).