Job Opportunities in Singapore
September 18, 2024
Applied Materials
Singapore
FULL TIME
Advanced Packaging Technology Process Integration Engineer
As a Process Integration Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies. In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, Io T, Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and integration process flow development to make sure projects are completed successfully and delivered on time.
This position is based in Singapore.
Responsibilities:
-
Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/ Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding
-
Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
-
Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
-
Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
-
Owns, manage, and drive technical programs/ project, report out timely status and interface with various stakeholders/management leading to completion.
Experiences:
-
Senior engineer level position: Minimum 5 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packaging or Assembly.
-
Entry level position: new colleague graduate is welcome.
-
Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.
-
Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous.
-
Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.
-
Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.
-
Demonstrate ability, experience, and good communication skills to work across different functions/ unit process owners and geographies to achieve technical outcome.
-
Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.
Work Location:
-
Science Park II
Qualifications
Education:
Bachelor's Degree
Skills:
Certifications:
Languages:
Years of Experience:
4 - 7 Years
Work Experience:
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Not Specified
Relocation Eligible:
No
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
We regret to inform you that this job opportunity is no longer available
Latest Job Opportunities
October 20, 2024
Fullsun Marketing Pte Ltd
IoT Product Specialist - Smart Hygiene
Rochor
FULL TIME & OTHER
View DetailsOctober 20, 2024
illuma Organisation
Marketing Coordinator -Immediate
Raffles
OTHER & FULL TIME
View Details
October 20, 2024
Dazzle Organisation
Junior Marketing Coordinator
Raffles
FULL TIME & INTERN & OTHER
View Details
October 20, 2024
Capgemini
14134005 - Life SG Actuarial Analyst
Singapore
FULL TIME & OTHER
View Details
October 20, 2024
Capgemini
L3 Production Support Engineer (Java/Banking Applications)
Singapore
CONTRACT
View DetailsSimilar Jobs
September 18, 2024
Qualcomm
Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort, Assembly)
Singapore
View Details
September 18, 2024
EY
Associate - Business Consulting, Technology Risk (2024 Graduates)
Singapore
View Details
September 18, 2024
DBS Bank
VP/ SVP, Third Party Risk Management, EASRE, Group Technology
View DetailsSeptember 17, 2024
LTA Land Transport Authority
[LTA-NXG] EXECUTIVE/ ENGINEER, ADVANCED POSITIONING AND ANALYTICS
FULL TIME
View DetailsNew Jobs from This Company
September 5, 2024
Applied Materials
Senior Account Technologist V (OLED) - (E5)
新竹市
OTHER
View Details
September 4, 2024
Applied Materials
Technical Product Support(TPS) Engineer II (Display YTG Group) - (E2)
新竹市
OTHER
View Details